Fail of the Week: OpenMV Kickstarter Project Hits Manufacturing Snag

Making stuff is hard, especially when you are making lots of stuff. The OpenMV Cam project knows this, because it has hit a problem while putting together their cheap machine vision module. The problem is with the BGA solder balls that connect the image sensor to the main board.

We’ve covered this intriguing project before: the aim is to build a small, cheap module that can run image processing algorithms to easily give robots sight. The sensor is a Ball Grid Array (BGA) package, which means there are a grid of small solder balls on the back that form the electrical connections. It seems that some of these solder balls are oxidized, preventing them from melting and fusing properly with the board. This is called a head-in-pillow defect, because the ball behaves like your head when you lie down in bed. Your head squishes the pillow, but doesn’t merge into it. There are 38 balls on the OV26040 image sensor and even a single bad link means a failure.

The makers of the project have tried a number of solutions, but it seems that they may have to remake the ball links on the back of each sensor. That’s an expensive process: they say it will cost $7 for each, more than the actual sensor cost initially.

A few people have been posting suggestions in the comments for the project, including using solvents and changing the way the sensors are processed before mounting. We’d like to see them overcome this hurdle. Anybody have any suggestions to quickly and cost effectively move the manufacturing process forward?

Thanks to [eDgE] for the tip.

Filed under: Fail of the Week, Hackaday Columns, hardware