A video recently surfaced touting a new method of joining materials together. It’s called MesoGlue, and apparently, it could replace soldering or even welding in certain cases.
First announced on this month’s Advanced Materials and Processes (caution, big file!) it seems… legit. The basic premise is it uses nanorods of material — kind of like velcro — that once you push together, intertwine with each other, and become solid. They’re surrounded with a shell that liquefies, which solidifies the bond. This makes it able to withstand high heat, once bonded.
This kind of technology could have an impact in the way we join solder circuits, pipes, bond IC’s to heat sinks, and attaching de-similar materials with different thermal expansion coefficients.
We’re no material scientist though, but since it did appear in ASM’s international publication of Advanced Materials and Processes — this could be the real deal.
What do you think? Conductive ink does work pretty well! Couple that with a good metallic glue and you could change PCBs dramatically.
[Thanks for the tip, Capa_D!]
Filed under: chemistry hacks
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